Development ofa Marketable Low Application Temperature Hot Melt Adhesive Based on the Poly(ethylene n-butyl acrylate) Copolymer
Schare, Joshua M.
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Current hot melt adhesives must be applied at 177°C for optimum application and performance characteristics. These adhesives are formulated around the poly(ethylene vinyl acetate), or EVA, copolymer. The use ofEVA hot melt adhesives leads to potential problems for low temperature substrates (because of the high application temperature), for example, frozen food packaging, and higher production costs through the use of large amounts of energy, equipment replacement, and downtime due to applicator upkeep (e.g. nozzles and filters) and worker accidents caused by severe burns. However, new formulation strategies in the past couple ofyears have made low temperature substrate application possible without damaging the product, while reducing the severity of worker accidents and the costs of production. These new formulation strategies have lead to hot melt adhesive application temperatures as low as 121°C by using lower Tg ethylene copolymers such as poly(ethylene acrylate) copolymers. The hot melt adhesives developed during the research described in this report are based on the poly(ethylene nbutyl acrylate), or EnBA, copolymer. The experimental low application temperature hot melt adhesives that were developed, as compared to the current 177°C hot melt adhesives, have both advantages and disadvantages in performance when using the same set of substrates.