Browsing by Subject "Adhesives, Hot melt"
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Development ofa Marketable Low Application Temperature Hot Melt Adhesive Based on the Poly(ethylene n-butyl acrylate) Copolymer (1996)Current hot melt adhesives must be applied at 177°C for optimum application and performance characteristics. These adhesives are formulated around the poly(ethylene vinyl acetate), or EVA, copolymer. The use ofEVA hot melt ...