Browsing by Subject "Adhesives, Hot melt"

Now showing items 1-1 of 1

Development ofa Marketable Low Application Temperature Hot Melt Adhesive Based on the Poly(ethylene n-butyl acrylate) Copolymer

Schare, Joshua M. (1996)

Current hot melt adhesives must be applied at 177°C for optimum application and performance characteristics. These adhesives are formulated around the poly(ethylene vinyl acetate), or EVA, copolymer. The use ofEVA hot melt ...